A New York State Center of Excellence at ßÙßÇÂþ»­

 

Partnering with industry for economic impact

Partnering with academia for research impact

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Save the Date: Electronics Packaging Symposium
CAMM photo

CAMM

The Center for Advanced Microelectronics Manufacturing (CAMM), a a partnership between ßÙßÇÂþ»­ (BU), i3 Electronics, Cornell University and the Flex Tech Alliance, is the nation's first prototype research and development (R&D) facility in large area flexible electronics.

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CASP

CASP addresses scientific challenges to reduce the cost of solar power and enhance energy efficiency. The center conducts research related to thin-film solar cells, supercapacitors, thermoelectric cells and reliability studies with an emphasis on Earth-abundant, low-toxicity materials.  

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ES2

The Center for Energy-Smart Electronic Systems works to develop systematic methodologies for efficiently operating electronic systems, including data centers, by controlling resources and managing workloads to achieve optimal energy consumption.

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IEEC

The IEEC is dedicated to the advancement of electronic packaging technology and the electronics industry. We conduct leading edge research in a wide variety of packaging areas for the technological and economic benefit of our member companies.

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NECCES

Better ways to store energy are critical to becoming more energy efficient. One of the keys to advances in energy storage lies in both finding novel materials and in understanding how current and new materials function.

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ADL

The Analytical and Diagnostics Laboratory (ADL) is a centralized, interdisciplinary, multi-user research and development facility at ßÙßÇÂþ»­ that promotes commercialization of microelectronic technologies.

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ßÙßÇÂþ»­ Our Facility

S3IP’s interdisciplinary teams of scientists and engineers moved into a new $30 million, 114,000-square-foot building in 2014. The two-story glass, metal and stone building has versatile laboratory space and offices that support ßÙßÇÂþ»­â€™s expanding industry partnerships.

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